Hydrosilex Cutting Compound: Medium Cut & Polish for Hologram-Free Shine

$66.99

Hydrosilex cutting compound is the latest formulation of diminishing abrasives providing a medium cut & polish for hologram-free results. Engineered specifically for use with dual-action or random orbital polishers, the abrasives break down very consistently to produce the highest depth of gloss. Hydrosilex cutting compound is water-based and contains no solvents, silicones, fillers, or petroleum. No dust is produced during polishing which makes for easy cleanup and prolongs the life of the polishing pads.

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Hydrosilex cutting compound is the latest formulation of diminishing abrasives providing a medium cut & polish for hologram-free results. Engineered specifically for use with dual-action or random orbital polishers, the abrasives break down very consistently to produce the highest depth of gloss. Hydrosilex cutting compound is water-based and contains no solvents, silicones, fillers, or petroleum. No dust is produced during polishing which makes for easy cleanup and prolongs the life of the polishing pads.

Hydrosilex cutting compound is the latest formulation of diminishing abrasives providing a medium cut & polish for hologram-free results. Engineered specifically for use with dual-action or random orbital polishers, the abrasives break down very consistently to produce the highest depth of gloss. Hydrosilex cutting compound is water-based and contains no solvents, silicones, fillers, or petroleum. No dust is produced during polishing which makes for easy cleanup and prolongs the life of the polishing pads.